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Fig. 6 | BMC Genomics

Fig. 6

From: GRIM-Filter: Fast seed location filtering in DNA read mapping using processing-in-memory technologies

Fig. 6

3D-stacked DRAM example. High Bandwidth Memory consists of stacked memory layers (four layers in the picture) and a logic layer connected by high bandwidth through-silicon vias (TSVs) and microbumps [13, 14, 69]. The 3D-stacked memory is then connected to a processor die with an interposer layer that provides high-bandwidth between the logic layer and the processing units on the package substrate

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